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Juniper Circuits

Leading manufacturer provides highly precise PCBs and Flex Circuits worldwide.

For a limited time, we are offering a
USD$500
credit for new account set up.
Our PCBs and FPCs products offer versatility and solution flexibility. Can make any printed circuit boards you designed, from Flex PCB to thick copper PCB to ceramic PCB, etc., as well as small and large size products. Provide ROHS compliant PCBs and FPCs and rigid-flex boards, as well as products with high-frequency functions or high-temperature functions or high-speed functions - just let us know your needs and we will let our expert designers and manufacturers make them for you circuit board. The biggest part of our advantage - we have experts at every stage of PCB development. We are a start-to-finish, turnkey, full-featured PCB manufacturing solution that can help you design, manufacture and assemble your circuit boards from testing to packaging and shipping.
PCB Capabilities
Item Conventional PCB HDI PCB RF/microwave Circuits
Mass production Small-lot/Sample Mass production Small-lot/Sample Mass production Small-lot/Sample
Max. layer 36 68 14 16 30 38
Finished board thickness(mm) 3.2 8 Min 0.3 Max 2.4 Min 0.25 Max 2.8 7 9
Dielectric layer thickness(mm) 0.05 0.04 0.028 0.025 0.05 0.025
Laminate Standard FR4, high-speed, high-frequency FR4， BT,high-speed(low loss, ultra low loss) Standard FR4, high-speed, high-frequency PTFE,High frequency hydrocarbon,metal base
Metal-base board / / Aluminum base plate,copper base, embedded copper
base copper thickness Innerlayer Min 0.33OZ Max 2OZ Min 0.33OZ Max 6OZ Min HOZ Max 3OZ Min 0.33OZ Max 4OZ Max: 12OZ Max: 12OZ
Outlayer Min 0.33OZ Max 3OZ Min 0.33OZ Max 6OZ Min HOZ Max 3OZ Min 0.33OZ Max 4OZ Max: 12OZ Max: 12OZ
Min borehole diameter Blind via(mm) / / 0.075 0.06 0.15 0.15
Buried via(mm) / / 0.15 0.1 0.15 0.15
Through hole(mm) 0.25 0.2 0.15 0.1 0.15 0.15
Hole diameter tolerance PTH(mm) ±0.05 ±0.05 ±0.05 ±0.035 ±0.05 ±0.04
NPTH(mm) ±0.05 ±0.03 ±0.05 ±0.03 ±0.05 ±0.025
Bore diameter of back drilled through hole(mm) / / / / 0.25 0.2
back drilling diameter(mm) / / / / D+0.2 D+0.15
back drilling depth tolerance(mm) ±0.075 ±0.05 / / ±0.075 ±0.05
back drilling stub(mm) / / / / 0.05-0.25 0.05-0.25
Max.plating hole aspect ratio(through hole) 8:1 12:1 8:1 10:1 15:1 25:1
Max.platinghole aspect ratio(laser) / / 0.8:1 1:1 0.8:1 1:1
warping degree ≤0.75% ≤0.50% ≤0.75% ≤0.50% ≤0.75% ≤0.50%
Width of Gold-finger(mm) 0.13 0.1 0.13 0.1 / /
Spacing of Gold-finger(mm) 0.1 0.1 0.13 0.1 / /
Half hole diameter(mm) 0.6 0.5 0.6 0.5 / /
CNC routing tolerance(mm) ±0.1 ±0.05 ±0.1 ±0.05 ±0.1 ±0.05
Punching tolerance(mm) ±0.1 ±0.06 / / ±0.1 ±0.05
S/M dam(mm) 0.075 0.062 0.075 0.065 0.08 0.062
Min. resin filled hole(mm) 0.15 0.15 0.2 0.15 0.15 0.15
Thickness diameter ratio of resin plug hole 12:1 16:1 8:1 12:1 12:1 16:1
Min.diameter of resistance welding plug hole(mm) 0.2 0.15 0.2 0.15 0.2 0.15
thickness diameter ratio of resistrance welding plug hole 10:1 12:1 6:1 8:1 10:1 12:1
Impedance tolerance ±10% ±7% ±8% ±6% ±10% ±8%
Min.line width/space(inner-layer)um 50/50 45/45 40/40 35/35 62/62 50/50
Min.line width/space(out-layer)um 50/50 45/50 40/40 35/35 76/76 62/62
Min.: BGA pad(mm) 0.225 0.175 0.17 0.15 0.22 0.2
Min.: BGA pitch(mm) 0.35 0.3 0.325 0.3 0.35 0.35
Max. board size(mm) 500*580 500*580 500*280 500*280 500*580 500*580
Surface treatment OSP,gold,tin,silver,OSP+gold(selective) lead-free tinspray,chemical nickel palladium gold plating(water gold) Gold melting,OSP, gold melting+OSP,electroplating soft gold, nickel palladium, nickel palladium+OSP ENIG,HAL,immersion silver,immersion tin,OSP,ENEPIG,plating har gold,gold plating,selective plating,carbon oil,blue glue
Specical process POFV, Buried capacitance,Buried resistance,Half slotted hole,Controlled deep milling Depth control drill,countersunk hole, gold finger,POFV,side metal edging,half hole Ladder groove,embedment,POFV,mechanical blind embedment hole, side wall metallization,half hole,high-frequency and high-speed mixed compression, bending,buried resistance,etc
FPC Capabilities
Item Rigid-Flex Circuits Flex Circuits
Mass production Small-lot/Sample Mass production Small-lot/Sample
Max.layer 14 24 8 12
Max.size(mm) 500*700 500*700 1000*485 1200*485
Min. board thickness(mm) / / 0.06 0.05
Max.board thickness(mm) 2.5 3 / /
Min.board thickness(base)(mm) 0.03 0.025 0.03 0.025
Min.line width/space(inner-layer)(um) 55/60 45/45 50/50 35/35
Min mechanical hole size(mm) 0.12 0.1 0.12 0.1
Max.aspect ratio(mechanical) 8:1 10:1 5:1 6:1
Min.laser aperture(um) 100 75 100 50
Coverlay alignment accuracy ±0.1 ±0.075 ±0.1 ±0.075
Stiffener fitting accuracy(mm) ±0.1 ±0.075 ±0.1 ±0.075
Min.BGA center distance(mm) 0.35 0.35 0.35 0.35
Min.SMT pad pitch(mm) 0.2 0.15 0.2 0.15
Min.solder dam(um) 100 75 75 75
Solder mask alignment(um) ±50 ±35 ±50 ±35
HDI rigid-flex board(HDI structure) 5 7 / /
Impedance control tolerance ±10% ±7% ±10% ±8%
Surface treatment ENIG,immersion silver,immersion tin,ENEPIG,plating har gold,gold plating ENIG,immersion silver,immersion tin,ENEPIG,plating har gold,gold plating